JEYI High-Performance Thermal Mud - Redefines cooling technology, ultimate performance upgrade
�� Super strong thermal conductivity | Cooling in seconds
>10W/m·K Super high thermal conductivity, heat is instantly exported
<0.021℃·in²/W Ultra-low thermal resistance, heat dissipation efficiency increased by 5 times
Thixotropic index 185, easy to shape, no flow, easier construction
�� Perfect fit | No fear of complex structure
0.1~3mm gap adaptive filling, easy coverage of CPU/GPU concave and convex surfaces
Fully compatible with curved surfaces/special shapes/holes, say goodbye to the traditional silicone fitting problem
❄️ Extremely stable | Durable
-20℃~150℃ Wide temperature adaptability, no brittle cracking, no volatility
��️Safe and environmentally friendly, safe to use
Low oil separation: Nearly zero oil seepage, avoid contamination of electronic components
Insulation design: Ensure circuit safety and prevent short circuit risks
Environmentally friendly formula: RoHS compliant, non-toxic and harmless
High Temperature Resistance
Ultra-low oil separation (close to zero),can maintain stable oil state for a long time at 150°C
