JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)
JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)

JEYI Pink Thermal Putty 6.0W/mK - High Performance Non-Curing Heat Transfer Compound for CPU GPU Electronics, Industrial Gap Filler Putty for PC Laptop PS5 VRM Chipsets (10g/20g/30g Options)

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JEYI Thermal Conductive Paste (Pink)

High Performance Non-Curing Thermal Conductive Paste

Technical Specifications

Color: Pink (high visibility for precise application)

Thermal Conductivity: Over 6.0 W/m-K

Thermal resistance: less than 0.028 °C-in²/W

Thixotropic index: 210 ± 10 (1/10mm measurement)

Specific gravity: 3.05 g/cm³

Operating temperature range: -20°C to +150°C

Available sizes: 10G, 20G, 30G

Key Advantages

Permanent plasticity: no drying out or cracking, unlike conventional thermal paste.

Excellent gap filling: perfect for uneven surfaces with gaps from 0.1 to 3mm

Safe for components: non-corrosive, non-conductive formulation

Reusable: can be reshaped and repositioned after initial use

Specialized applications

Industrial electronics: for power converters, LED drivers and automotive control units

Telecom: for 5G base stations, router chipsets and RF modules

DIY Repair: for game console chipsets and laptop voltage regulator modules

Specialized use: filling gaps between heat pipes and chassis, mounting heat sinks on irregular surfaces

Packaging Options

10 grams: covers about 8 CPU or GPU chips (for personal use)

20 grams: services 15 to 20 devices (great for repair stores)

30 grams: serves 25 or more applications (best for industrial volume use)

High Temperature Resistance

Ultra-low oil separation (close to zero)can maintain stable oil state for a long time at 150°C

Applicable scenarios

Gaming computers and consoles: high-end CPU/GPU, PS5/Xbox Series X thermal maintenance

Workstations and creators: 3D rendering/video editing equipment, AI/ML development equipment

Data centers and enterprise-level: server processors, cloud computing hardware

Industrial electronics: 5G infrastructure equipment, automotive computing systems

DIY computer assembly: custom liquid cooling configurations, small computers

Product Use Precautions

1. Apply evenly without impurities or bubbles.

2.Recommended thickness:0.13mm~0.15mm.